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Req. ID: 143069
_Title :_ Study and development of clean bevel in 3D nand Non-Volatile
Memory
_Description :_ Due to complexity of memory structure- there are a lot of
new processes and tools being introduced resulted new type of defects which
affecting wafer quality. In this project- student will have exposure on most
advance semiconductor machines- gain experience on the state-of-the-art fab
operation and attain process development/troubleshooting knowledge as require
working with process engineering team on improvement work.
_Scope :_
Perform data collection on WiseCam- G6/G7 API- KMAC Bevel Image and KMAC Backsid
Collaboration with process engineers for process improvemen
Students will be able to learn how to use statistical tools- fab specific applications and software for process- perform design of experiment to optimize process
_Deliverable :_
Line comb movie of 1XX layers technode
Develop Best Known Method to have clean bevel and clean backside
All qualified applicants will receive consideration for employment without
regard to race- color- religion- sex- sexual orientation- gender identity-
national origin- veteran or disability status.